Adhesive technology

EMI/RFI shielding with adhesive solutions: metal foil and graphite-containing adhesives in electronics

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In electronics, electromagnetic interference (EMI) and radio frequency interference (RFI) can cause serious malfunctions in sensitive circuits. Shielding is essential to prevent such interference, and one effective, quick-to-apply form of shielding is the use of conductive adhesives. In this article, we will discuss the role of metal foil and graphite-containing adhesives in electronics manufacturing, with a special focus on H-Splitter's customized solutions.

EMI and RFI: an industrial challenge

The source of the interfering electromagnetic radiation may be the equipment itself or external environmental influences. To ensure precise operation, sensitive units must be shielded. Shielding provided by adhesive technology is particularly suitable in cases where space and weight-efficient solutions are required.

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Metal foil adhesives: structure and advantages

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Metal foil adhesives typically have an aluminum or copper backing, to which a conductive adhesive is applied on one or both sides. These materials are:

provide high conductivity,
form a continuous shading layer,
excellent contouring,
They are also compatible with automated applications.

Graphite-based adhesives: a flexible alternative

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The advantage of graphite-containing, filled acrylic adhesives is that they have no metallic components, yet still provide excellent conductivity. These materials are:

more flexible, better follow the shape of the part,
resistant to chemical effects,
Excellent for self-adhesive and contact precise shielding.

Areas of application

inner surface of control module covers,
shielding of displays and touch panels,
electromagnetic protection of sensitive sensors,
circuit components for mobile devices and portable devices.

H-Splitter solution: adhesive cut to shape

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H-Splitter manufactures contour-cut, die-cut solutions from 3M and Tesa conductive adhesives, tailored to customer requirements. This enables fast, repeatable application with high positioning accuracy, even in automated manufacturing processes.

Technology consulting and testing

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The effectiveness of bonded shading can be measured and modeled. H-Splitter helps you choose the right material and shape, with testing options available.

Conductive, adhesive shielding is not only effective, but also a production-friendly solution for EMI/RFI protection. If you are looking for a modern, automatable solution for your sensitive electronic components, please contact us.

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